Packaging Studies

GLSV-packagingSystem design

GLSV utilizes the latest 3D CAD and CAE tools for engineering design. Packaging studies consider multi-disciplinary performance aspects such as thermal management, acoustics, and signature management.

GLSV uses a comprehensive approach to system design and packaging:

  • Preliminary design feasibility studies
  • Multidisciplinary engineering (NVH, thermal management, signature, acoustics)
  • Sensitivity studies
  • Tolerance stackup analysis
  • Space claim
  • Assembly & maintenance considerations
  • Human factors considerations
  • Flexible multibody assemblies



GLSV Added Value

  • Solid 3D CAD modeling
  • Concept development
  • Prototype
  • Motion analysis
  • Design calculations
  • NVH performance
  • Optimization
  • Multibody dynamics
  • Numerical acoustics
  • Structural analysis