System design
GLSV utilizes the latest 3D CAD and CAE tools for engineering design. Packaging studies consider multi-disciplinary performance aspects such as thermal management, acoustics, and signature management.
GLSV uses a comprehensive approach to system design and packaging:
- Preliminary design feasibility studies
- Multidisciplinary engineering (NVH, thermal management, signature, acoustics)
- Sensitivity studies
- Tolerance stackup analysis
- Space claim
- Assembly & maintenance considerations
- Human factors considerations
- Flexible multibody assemblies