Packaging Studies

System design

GLSV utilizes the latest 3D CAD and CAE tools for engineering design. Packaging studies consider multi-disciplinary performance aspects such as thermal management, acoustics, and signature management.

GLSV uses a comprehensive approach to system design and packaging:

  • Preliminary design feasibility studies
  • Multidisciplinary engineering (NVH, thermal management, signature, acoustics)
  • Sensitivity studies
  • Tolerance stackup analysis
  • Space claim
  • Assembly & maintenance considerations
  • Human factors considerations
  • Flexible multibody assemblies